Search results
- The 14 nanometer (14 nm) lithography process is a semiconductor manufacturing process node serving as shrink from the 22 nm process. The term "14 nm" is simply a commercial name for a generation of a certain size and its technology, as opposed to gate length or half pitch.
en.wikichip.org › wiki › 14_nm_lithography_process
People also ask
What is a 14 nanometer process?
What is Intel's 14 nm process?
What is a 14 nm fabrication node?
What is 14 nm technology?
The "14 nanometer process" refers to a marketing term for the MOSFET technology node that is the successor to the "22 nm" (or "20 nm") node. The "14 nm" was so named by the International Technology Roadmap for Semiconductors (ITRS).
Apr 15, 2014 · Intel has developed a true 14 nm technology with industry-leading performance, power, density and cost per transistor. The 14 nm technology and the lead processor product are now qualified and in volume production. A full menu of SoC transistor and interconnect features are provided.
- 748KB
- 53
Nov 26, 2019 · Everything about 7nm, 10nm and 14nm Fabrication Process of TSMC, Intel, and Samsung. Transistor Density & Ranking of different technology nodes.
May 25, 2023 · The 14 nanometer (14 nm) lithography process is a semiconductor manufacturing process node serving as shrink from the 22 nm process. The term "14 nm" is simply a commercial name for a generation of a certain size and its technology, as opposed to gate length or half pitch.
Aug 11, 2014 · Coinciding with today’s embargo on Intel’s 14nm technology and a preview of Intel’s upcoming Broadwell architecture based Core M processor, Intel will be holding a presentation dubbed ...
Intel’s 14 nm technology is in high- volume production today and is being used to manufacture products including high-performance servers and FPGAs as well as low-power personal computing devices, mobile devices, modems and products for the Internet of Things (IoT).
Nov 5, 2018 · Transistor performance meets great technical challenges as the critical dimension (CD) shrinking beyond 32/28-nm nodes. A series of innovated process technologies such as high-k/metal gate, strain engineering, and 3D FinFET to overcome these challenges are reviewed in this chapter.
