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      • Worst case scenarios lead to film cracking for layers subjected to tensile stress1,2or peeling off, buckling or blistering in the case of compressive stress.3–6Residual stress distributions can significantly impact the adhesion and the fracture toughness of thin films,7–9the ductility of bulk metallic glasses (BMG),10the performance of optoelectronic and aerospace components,11the thermo- mechanical behavior of stacks in Through Silicon Vias (TSV) 3D integrated devices,12the resonant frequency...
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  2. Mar 5, 2018 · The presence of stress in thin films and functional coatings constitutes a major concern in many technological applications as excessive residual stress levels can dramatically affect the performance, reliability, and durability of material components and devices.

    • What are the possible effects of stress on the film?1
    • What are the possible effects of stress on the film?2
    • What are the possible effects of stress on the film?3
    • What are the possible effects of stress on the film?4
    • What are the possible effects of stress on the film?5
  3. I. Introduction. The presence of stress in thin films and functional coatings constitutes a major concern in many technological applications as excessive residual stress levels can dramatically affect the performance, reliability and durability of material components and devices.

    • Molecular Dynamics Simulations
    • Film Morphology and Stress Evolution
    • Adatom Insertion and Thin Film Stress

    To elucidate mechanisms leading to compressive film stress development during growth of continuous, polycrystalline film, Pao et al. carried out a series of molecular dynamics (MD) simulations of Ni deposition onto a Ni(111) surface intersected by two GBs to investigate the interplay of growth stress, grain boundaries, and diffusion [15, 16]. To si...

    Figure 7 shows surface morphology evolution of systems B and C. In Fig. 7, atoms are shaded according to their centrosymmetry parameter and only atoms with centrosymmetry greater than 6.0 are displayed (centrosymmetry equals zero for atoms in an ideal, bulk FCC environment; larger centrosymmetry parameter values indicate more significant deviation...

    Figure 9 a shows the number of atoms per layer (of thickness equal to the {111} plane spacing), NL as a function of distance from the surface, D (D = 0 is the free surface), for system B at three values of tf. These results demonstrate that during deposition, the atomic density in the film, near the surface, increases; i.e., extra atoms are incorpo...

    • cwpao@gate.sinica.edu.tw
  4. Aug 27, 2018 · The magnitude and distribution of residual stresses in a component or structure is a significant source of uncertainty in MEMS design and one that can affect subsequent micromachining as well as life prediction and assessment of structural integrity.

    • N. Sharma, M. Hooda, S. K. Sharma
    • 2019
  5. repulsive), the surface stress is tensile or compres-sive. The surface or interface stress can therefore be thought of as a stretched or compressed membrane that lies in the plane of the surface or interface and exerts lateral forces on the surrounding phases. As illustrated by Fig. 1, a tensile surface stress pulls in

    • 523KB
    • 12
  6. Nov 15, 2016 · Thin films can develop large residual stresses during their growth that significantly impact their performance. Therefore, there is a need to understand how the stress is related to the developing film structure and underlying kinetic processes.

  7. Jan 1, 2021 · For layers subjected to tensile stress, excessive stress values can lead to film crazing or cracking [2], [3], [4], while decohesion through buckles or blisters are observed for compressively stressed layers [5], [6], [7], [8], [9], [10].

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