Search results
19 hours ago · Akira (Japanese: アキラ) is a 1988 Japanese animated cyberpunk action film [4] directed by Katsuhiro Otomo, produced by Ryōhei Suzuki and Shunzō Katō, and written by Otomo and Izo Hashimoto, based on Otomo's 1982 manga of the same name. Set in a dystopian 2019, it tells the story of Shōtarō Kaneda, the leader of a biker gang whose ...
- Akira (Manga)
Akira (アキラ, stylized as AKIRA) is a Japanese cyberpunk...
- Tsutomu Ōhashi
He held positions such as Instructor at Tsukuba University,...
- Akira (Franchise)
Akira creator Otomo posing on a replica of the futuristic...
- Jamieson Price
Jamieson K. Price is an American actor, best known for his...
- Cam Clarke
Cam Clarke is an American voice actor, known for his work in...
- Video Game
Main page; Contents; Current events; Random article; About...
- Akira (Manga)
19 hours ago · LINEで送る. 小田香監督の5年ぶりとなる長編映画『Underground アンダーグラウンド』が2025年2月にユーロスペースほかにて全国順次公開されることが ...
19 hours ago · A Few Moments of Cheers est au Japon sorti le 14 juin.. L'histoire du film lorsqu'un lycéen qui créée des clips musicaux, Asaya Kanata, alors qu'il tombe sur une professeure qui joue de la ...
19 hours ago · <p>Wearing a cardboard box as armor, the box man is trying to make the world his own.A feature film adaptation of Kobo Abe’s novel “Hako Otoko” (“The Box Man”) was released in August.Director Gakuryu Ishii, a titan of cinema, was supposed to make a movie based on the novel 27 years ago, but the project was abandoned the day before shooting was to begin, becoming a phantom work in the ...
19 hours ago · Sep 20, 2024 18:00:00 Headline News for September 20, 2024. The production decision for the new Patlabor series, Mobile Police Patlabor EZY, was announced in 2017 and the pilot film was released ...
Sep 21, 2024 · A Tokyo, les architectes, en quête d'équilibre entre ville et cités-jardins à petite échelle, développent un nouveau mode d'urbanisme vert inspiré de la tradition. Regisseurs Michael Trabitzsch
19 hours ago · Resonac Corporation (TOKYO:4004) (President: Hidehito Takahashi, hereinafter “Resonac”) has developed a temporary bonding film to be used for supporting a wafer on a glass carrier temporarily in the semiconductor device fabrication process (front-end process) and semiconductor packaging process (back-end process), as well as its debonding process.
