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The Power and Propulsion Element ( PPE ), previously known as the Asteroid Redirect Vehicle propulsion system, is a planned solar electric ion propulsion module being developed by Maxar Technologies for NASA. It is one of the major components of the Lunar Gateway. The PPE will allow access to the entire lunar surface and a wide range of lunar ...
Processor register. A processor register is a quickly accessible location available to a computer's processor. [1] Registers usually consist of a small amount of fast storage, although some registers have specific hardware functions, and may be read-only or write-only.
The Xetal has 320 16-bit processor elements especially designed for vision tasks. Intel's AVX-512 SIMD instructions process 512 bits of data at once. Software The ordinary tripling of four 8-bit numbers. The CPU loads one 8-bit number into R1, multiplies it with R2, and then saves the answer from R3 back to RAM.
POWER9 is a family of superscalar, multithreading, multi-core microprocessors produced by IBM, based on the Power ISA.It was announced in August 2016. The POWER9-based processors are being manufactured using a 14 nm FinFET process, in 12- and 24-core versions, for scale out and scale up applications, and possibly other variations, since the POWER9 architecture is open for licensing and ...
Thermistor. A thermistor is a semiconductor type of resistor whose resistance is strongly dependent on temperature, more so than in standard resistors. The word thermistor is a portmanteau of thermal and resistor . Thermistors are categorized based on their conduction models. Negative-temperature-coefficient (NTC) thermistors have less ...
Asynchronous circuit ( clockless or self-timed circuit) [1] : Lecture 12 [note 1] [2] : 157–186 is a sequential digital logic circuit that does not use a global clock circuit or signal generator to synchronize its components. [1] [3] : 3–5 Instead, the components are driven by a handshaking circuit which indicates a completion of a set of ...
POWER5+. The POWER5+ is an improved iteration of the POWER5 introduced on 4 October 2005. Improvements initially were lower power consumption, due to the newer process it was fabricated in. The POWER5+ chip uses a 90 nm fabrication process. This resulted in the die size decrease from 389 mm 2 to 243 mm 2 .
